纳米铜基柔性导电薄膜制备现状及前景

Yongde Huang; Peng Peng; Wei Guo; Xingwen Zhou; Guowen Cheng; Qiang Liu

doi:10.12073/j.hjxb.20220709002

纳米铜基柔性导电薄膜制备现状及前景

Yongde Huang
, Peng Peng
, Wei Guo
, Xingwen Zhou^*
, Guowen Cheng
, Qiang Liu

^*此作品的通讯作者

机械工程及自动化学院

科研成果: 期刊稿件 › 文章 › 同行评审

2 引用（Scopus）

投稿的翻译标题	Current status and prospect of preparation of nano-copper based flexible conductive films
源语言	繁体中文
页（从-至）	147-156
页数	10
期刊	Hanjie Xuebao/Transactions of the China Welding Institution
卷	43
期	11
DOI	https://doi.org/10.12073/j.hjxb.20220709002
出版状态	已出版 - 11月 2022

访问文件

10.12073/j.hjxb.20220709002

其它文件与链接

链接到 Scopus 的出版物

引用此

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title = "纳米铜基柔性导电薄膜制备现状及前景",

author = "Yongde Huang and Peng Peng and Wei Guo and Xingwen Zhou and Guowen Cheng and Qiang Liu",

year = "2022",

month = nov,

doi = "10.12073/j.hjxb.20220709002",

language = "繁体中文",

volume = "43",

pages = "147--156",

journal = "Hanjie Xuebao/Transactions of the China Welding Institution",

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T1 - 纳米铜基柔性导电薄膜制备现状及前景

AU - Huang, Yongde

AU - Peng, Peng

AU - Guo, Wei

AU - Zhou, Xingwen

AU - Cheng, Guowen

AU - Liu, Qiang

PY - 2022/11

Y1 - 2022/11

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DO - 10.12073/j.hjxb.20220709002

M3 - 文章

AN - SCOPUS:85145551223

SN - 0253-360X

VL - 43

SP - 147

EP - 156

JO - Hanjie Xuebao/Transactions of the China Welding Institution

JF - Hanjie Xuebao/Transactions of the China Welding Institution

IS - 11

ER -