基于高热流密度芯片的金刚石歧管针翅散热器传热特性实验研究

A manifold pin-fin microchannel diamond heat sink for high heat flux chips was designed and fabricated. Thermal performance of the heat sink in a pump-driven two-phase ammonia loop was investigated using a thermal test chip as a simulated heat source. Chip surface temperature of 102.5 ℃ with thermal resistance of 0.151 K·W^-1 and pressure drop of 1.1 kPa under localized heat flow of 1510 W·cm^-2 were obtained. The effects of inlet temperature, heat flux, and mass flow rate on thermal resistance and pressure drop of the heat sink were investigated, and it was found that the thermal resistance of the heat sink was minimized under higher inlet temperature conditions. Keeping all the other operating parameters consistent, the thermal resistance of the diamond manifold pin-fin microchannel radiator was 33.32% smaller and the pressure drop was 23.88% lower under 710 W·cm^-2 heat flow conditions when compared with the expanded and contracted manifold microchannel radiator made of copper.