一种解耦硅MEMS陀螺结构优化及性能仿真

Yiyi Wang; Zhen Zhou

doi:10.16818/j.issn1001-5868.2019.05.002

一种解耦硅MEMS陀螺结构优化及性能仿真

Yiyi Wang^*
, Zhen Zhou

^*此作品的通讯作者

仪器科学与光电工程学院

Beihang University

科研成果: 期刊稿件 › 文章 › 同行评审

摘要

A decoupled silicon MEMS gyroscope was optimized to realize a high mechanical sensitivity, and its performance of modal, stress, displacement, overload resistance and harmonic response was analyzed and simulated by using the finite element analysis software ANSYS. The principles for structure optimization of the high-sensitivity MEMS gyro were confirmed and verified. The resonant frequencies of the optimized silicon MEMS gyro under driving and sensing modes are 3 700 and 3 718 Hz, respectively, and the mechanical sensitivity is up to 0.95 nm/(°/s). The gyro can endure the impact load of 500 g and realize the decoupling of driving and sensing modes.

投稿的翻译标题	Structural Optimization and Performance Simulation on a Decoupled Silicon MEMS Gyro
源语言	繁体中文
页（从-至）	610-614 and 648
期刊	Bandaoti Guangdian/Semiconductor Optoelectronics
卷	40
期	5
DOI	https://doi.org/10.16818/j.issn1001-5868.2019.05.002
出版状态	已出版 - 1 10月 2019

关键词

ANSYS simulation
Finite element analysis
MEMS gyro
Mechanical decoupling
Structure optimization

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10.16818/j.issn1001-5868.2019.05.002

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引用此

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abstract = "A decoupled silicon MEMS gyroscope was optimized to realize a high mechanical sensitivity, and its performance of modal, stress, displacement, overload resistance and harmonic response was analyzed and simulated by using the finite element analysis software ANSYS. The principles for structure optimization of the high-sensitivity MEMS gyro were confirmed and verified. The resonant frequencies of the optimized silicon MEMS gyro under driving and sensing modes are 3 700 and 3 718 Hz, respectively, and the mechanical sensitivity is up to 0.95 nm/(°/s). The gyro can endure the impact load of 500 g and realize the decoupling of driving and sensing modes.",

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AU - Wang, Yiyi

AU - Zhou, Zhen

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N2 - A decoupled silicon MEMS gyroscope was optimized to realize a high mechanical sensitivity, and its performance of modal, stress, displacement, overload resistance and harmonic response was analyzed and simulated by using the finite element analysis software ANSYS. The principles for structure optimization of the high-sensitivity MEMS gyro were confirmed and verified. The resonant frequencies of the optimized silicon MEMS gyro under driving and sensing modes are 3 700 and 3 718 Hz, respectively, and the mechanical sensitivity is up to 0.95 nm/(°/s). The gyro can endure the impact load of 500 g and realize the decoupling of driving and sensing modes.

AB - A decoupled silicon MEMS gyroscope was optimized to realize a high mechanical sensitivity, and its performance of modal, stress, displacement, overload resistance and harmonic response was analyzed and simulated by using the finite element analysis software ANSYS. The principles for structure optimization of the high-sensitivity MEMS gyro were confirmed and verified. The resonant frequencies of the optimized silicon MEMS gyro under driving and sensing modes are 3 700 and 3 718 Hz, respectively, and the mechanical sensitivity is up to 0.95 nm/(°/s). The gyro can endure the impact load of 500 g and realize the decoupling of driving and sensing modes.

KW - ANSYS simulation

KW - Finite element analysis

KW - MEMS gyro

KW - Mechanical decoupling

KW - Structure optimization

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DO - 10.16818/j.issn1001-5868.2019.05.002

M3 - 文章

AN - SCOPUS:85074989285

SN - 1001-5868

VL - 40

SP - 610-614 and 648

JO - Bandaoti Guangdian/Semiconductor Optoelectronics

JF - Bandaoti Guangdian/Semiconductor Optoelectronics

IS - 5

ER -

一种解耦硅MEMS陀螺结构优化及性能仿真

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