Wear modelling of slipper/swashplate pair for highspeed piston pump under transient lubrication conditions

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Wear phenomenon occurring in the slipper/swashplate pair of the high-speed piston pump is investigated in this paper. Analytical model along with the finite difference method is adopted to solve the transient thermo-elasto-hydrodynamic (TEHD) lubrication process. The proposed approach considers the slipper wear clearance and deformations caused by thermal deflection and hydrostatic pressure. The results show that the lubricating oil film is unevenly distributed. Consequently, discrete friction area wear model is proposed to account for the partial abrasion characteristics. In addition, the slipper wear profile is dynamically updated with the pump working time extended. The simulation results indicate that the wear of the slipper pair can be reduced by operating the pump within the high-speed/low pressure/small displacement zone.

Original languageEnglish
Title of host publicationProceedings of the 16th IEEE Conference on Industrial Electronics and Applications, ICIEA 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2124-2129
Number of pages6
ISBN (Electronic)9781665422482
DOIs
StatePublished - 1 Aug 2021
Event16th IEEE Conference on Industrial Electronics and Applications, ICIEA 2021 - Chengdu, China
Duration: 1 Aug 20214 Aug 2021

Publication series

NameProceedings of the 16th IEEE Conference on Industrial Electronics and Applications, ICIEA 2021

Conference

Conference16th IEEE Conference on Industrial Electronics and Applications, ICIEA 2021
Country/TerritoryChina
CityChengdu
Period1/08/214/08/21

Keywords

  • Axial piston pump
  • Lubrication
  • Slipper/swashplate pair
  • Wear

Fingerprint

Dive into the research topics of 'Wear modelling of slipper/swashplate pair for highspeed piston pump under transient lubrication conditions'. Together they form a unique fingerprint.

Cite this