TY - GEN
T1 - Uncertain Degradation Process Modeling Method of Integrated Circuit Chip
AU - Yao, Yuan
AU - Chen, Ying
AU - Wang, Zhen
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - As an important part of electronic products, it is worth paying attention to whether integrated circuit chip can work reliably for a long time. In this paper, based on reliability scientific experiment including performance consistency experiment, reliability domain experiment and degradation law experiment, we use uncertain hypothesis test to determine consistency of performance parameter, and give a method to construct uncertain degradation process model with small samples by using arithmetic Liu process and uncertain maximum likelihood estimation. Taking operational amplifier as an example, the reliability scientific experiment is carried out. Ultimately, it is concluded that the degradation process interval obtained by uncertain maximum likelihood estimation is more in line with the experiment data than that acquired by least squares principle.
AB - As an important part of electronic products, it is worth paying attention to whether integrated circuit chip can work reliably for a long time. In this paper, based on reliability scientific experiment including performance consistency experiment, reliability domain experiment and degradation law experiment, we use uncertain hypothesis test to determine consistency of performance parameter, and give a method to construct uncertain degradation process model with small samples by using arithmetic Liu process and uncertain maximum likelihood estimation. Taking operational amplifier as an example, the reliability scientific experiment is carried out. Ultimately, it is concluded that the degradation process interval obtained by uncertain maximum likelihood estimation is more in line with the experiment data than that acquired by least squares principle.
KW - performance degradation
KW - reliability scientific experiment
KW - uncertain maximum likelihood estimation
UR - https://www.scopus.com/pages/publications/85181766939
U2 - 10.1109/SRSE59585.2023.10336110
DO - 10.1109/SRSE59585.2023.10336110
M3 - 会议稿件
AN - SCOPUS:85181766939
T3 - 2023 5th International Conference on System Reliability and Safety Engineering, SRSE 2023
SP - 181
EP - 185
BT - 2023 5th International Conference on System Reliability and Safety Engineering, SRSE 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th International Conference on System Reliability and Safety Engineering, SRSE 2023
Y2 - 20 October 2023 through 23 October 2023
ER -