"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

Ying Liu; Yong Jun Xie; Yong Zhang

doi:10.3969/j.issn.1001-0548.2010.05.016

"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

Ying Liu^*
, Yong Jun Xie
, Yong Zhang

^*Corresponding author for this work

School of Electronic and Information Engineering

Xidian University
ANSYS, Inc.

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

Original language	English
Pages (from-to)	720-724
Number of pages	5
Journal	Dianzi Keji Daxue Xuebao/Journal of the University of Electronic Science and Technology of China
Volume	39
Issue number	5
DOIs	https://doi.org/10.3969/j.issn.1001-0548.2010.05.016
State	Published - Sep 2010

Keywords

Antenna integration
Electromagnetic compatibility
Shielding effect
Top-down

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abstract = "The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.",

keywords = "Antenna integration, Electromagnetic compatibility, Shielding effect, Top-down",

author = "Ying Liu and Xie, \{Yong Jun\} and Yong Zhang",

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AU - Xie, Yong Jun

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N2 - The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

AB - The top-down electromagnetic compatibility (EMC) design flow and its applications in multi-vehicle communication system, which is based on EDA software, are introduced. For the EMC problems such as antenna interaction, enclosure leakage and radiation of printed circuit board (PCB) in a four-vehicle communication system, the design flow from system level and device level to PCB level is present with simulation procedure. The results show that this design flow can obviously improve the electromagnetic immunity of the system and make the design first pass success.

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KW - Electromagnetic compatibility

KW - Shielding effect

KW - Top-down

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"Top-Down" design flow and its applications in multi-vehicle communication system's EMC design

Abstract

Keywords

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