@inproceedings{2f7edaf61f4e406ba936b96d6d74ee64,
title = "Thermo-mechanical reliability of 3D package under different thermal cycling",
abstract = "In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder joints was extended by using of unerfill. The influence of TSV arrangement on the fatigue life of solder was compared.",
keywords = "fatigue life, solder joint, three-dimensional package finite element",
author = "Tianbao Lan and Fei Su",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014 ; Conference date: 12-08-2014 Through 15-08-2014",
year = "2014",
month = oct,
day = "13",
doi = "10.1109/ICEPT.2014.6922844",
language = "英语",
series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1138--1141",
editor = "Keyun Bi and Zhong Tian and Ziqiang Xu",
booktitle = "2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014",
address = "美国",
}