TY - GEN
T1 - Thermal and vibration mechanical reliability of multicoat compound thin-film thermocouple
AU - Xi, Yiyun
AU - Sun, Yunfeng
AU - Hu, Tingchun
AU - Zhao, Guangyan
N1 - Publisher Copyright:
© 2021 Trans Tech Publications Ltd, Switzerland.
PY - 2021
Y1 - 2021
N2 - For the thin-film thermocouple with ITO/In2O3 as the functional layer, the mechanical reliability of their composite multilayer membrane structures under high temperature and random vibration conditions are discussed. Using the elastic plasticity model based on the finite element simulation method, the stress and strain distribution patterns caused by the thermal mismatch and vibration of multilayer film materials are systematically analyzed, and the distribution of the stress concentration and strain accumulation regions that may lead to fatal reliability problems are characterized. When a thermal load of 1000°C is applied, the protective layer of the structure is vulnerable to severe stress environment. In addition, plastic deformation occurs in the adjacent layers of the functional layer, making it a weak reliability area. The stress generated by the vibration load is much smaller than the thermal stress, which mainly occurs at the roots of the structure, where prolonged loading may lead to fatigue failure.
AB - For the thin-film thermocouple with ITO/In2O3 as the functional layer, the mechanical reliability of their composite multilayer membrane structures under high temperature and random vibration conditions are discussed. Using the elastic plasticity model based on the finite element simulation method, the stress and strain distribution patterns caused by the thermal mismatch and vibration of multilayer film materials are systematically analyzed, and the distribution of the stress concentration and strain accumulation regions that may lead to fatal reliability problems are characterized. When a thermal load of 1000°C is applied, the protective layer of the structure is vulnerable to severe stress environment. In addition, plastic deformation occurs in the adjacent layers of the functional layer, making it a weak reliability area. The stress generated by the vibration load is much smaller than the thermal stress, which mainly occurs at the roots of the structure, where prolonged loading may lead to fatigue failure.
KW - Mechanical reliability
KW - Thermal load
KW - Thin film stress
KW - Thin film thermocouple
KW - Vibration load
UR - https://www.scopus.com/pages/publications/85105952172
U2 - 10.4028/www.scientific.net/KEM.881.57
DO - 10.4028/www.scientific.net/KEM.881.57
M3 - 会议稿件
AN - SCOPUS:85105952172
SN - 9783035737622
T3 - Key Engineering Materials
SP - 57
EP - 63
BT - Material Science and Engineering
A2 - Bhattacharyya, Debnath
A2 - Hu, X.Y.
PB - Trans Tech Publications Ltd
T2 - 7th International Conference on Material Science and Engineering, ICMSE 2020
Y2 - 18 December 2020 through 20 December 2020
ER -