Theoretical Assessment Model and Simulation Verification of Temperature Effects in Suspended Adhesive MEMS Accelerometers

The temperature effect of the sensor's performance is analyzed by establishing a general mechanical-thermal coupling model. Specifically, the model isolates the thermal effects of materials and electrical thermal effects from the mechanical structure, thereby simplifying the analysis of temperature influences on the mechanical system. By this way, the input-output relationship under various temperature conditions is derived, and analytical expressions for the temperature drift of bias (TDB) and the temperature drift of scale factor (TDSF) are established. Additionally, to verify the accuracy of the model, numerical simulations are conducted. The results show that the relative error is within 3%. The errors of TDB and TDSF are 2.24% and 3.85%, respectively. This demonstrates the model's ability to accurately predict the impact of temperature changes on sensor output, confirming its reliability and precision.