Theoretical analysis of stresses in interface of bonded wafers

Zhen Zhou; Xijun Kong; Yongqing Huang; Xiaomin Ren

Theoretical analysis of stresses in interface of bonded wafers

Zhen Zhou^*
, Xijun Kong
, Yongqing Huang
, Xiaomin Ren

^*Corresponding author for this work

Beijing University of Posts and Telecommunications

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips. The characteristics of distribution of the shearing stresses, as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.

Original language	English
Pages (from-to)	1176-1179
Number of pages	4
Journal	Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
Volume	24
Issue number	11
State	Published - Nov 2003
Externally published	Yes

Keywords

Bonding
Normal stress
Peeling stress
Shearing stress

Cite this

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title = "Theoretical analysis of stresses in interface of bonded wafers",

abstract = "The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips. The characteristics of distribution of the shearing stresses, as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.",

keywords = "Bonding, Normal stress, Peeling stress, Shearing stress",

author = "Zhen Zhou and Xijun Kong and Yongqing Huang and Xiaomin Ren",

year = "2003",

month = nov,

language = "英语",

volume = "24",

pages = "1176--1179",

journal = "Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors",

issn = "0253-4177",

publisher = "Kexue Chubaneshe/Science Press",

number = "11",

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TY - JOUR

T1 - Theoretical analysis of stresses in interface of bonded wafers

AU - Zhou, Zhen

AU - Kong, Xijun

AU - Huang, Yongqing

AU - Ren, Xiaomin

PY - 2003/11

Y1 - 2003/11

N2 - The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips. The characteristics of distribution of the shearing stresses, as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.

AB - The theoretical distribution of stresses in the interface of bonded wafers and thin films subjected to uniform heating or cooling are studied according to the theory of stresses arising in bimetal strips. The characteristics of distribution of the shearing stresses, as well as normal and peeling stresses which influence the quality of bonded wafers are discussed.

KW - Bonding

KW - Normal stress

KW - Peeling stress

KW - Shearing stress

UR - https://www.scopus.com/pages/publications/1942445426

M3 - 文章

AN - SCOPUS:1942445426

SN - 0253-4177

VL - 24

SP - 1176

EP - 1179

JO - Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

JF - Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

IS - 11

ER -

Theoretical analysis of stresses in interface of bonded wafers

Abstract

Keywords

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