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The Structural Reliability Analysis Method of Electronic System Based on the Dependent Failure Processes

  • Beihang University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Structural failure is a critical failure mode in electronic systems. However, existing reliability analysis methods struggle to comprehensively evaluate the structural performance of such systems. This paper models the structural damage process with the influence of wear-out mechanisms and the structural shock process with the influence of overstress mechanisms. Furthermore, it defines the Dependent Competing Failure Process (DCFP) group to characterize the structural performance of electronic systems from two perspectives: structural durability and ultimate tolerance. The structural reliability of the system is then analyzed under three types of DCFP groups: joint effect type, unilateral dependency type, and bilateral dependency type. Building on this framework, the study further considers the phenomenon of multi-point concurrent structural degradation within electronic systems. Using the unmanned aircraft drive control circuit as a case study, the proposed method is implemented to demonstrate its effectiveness.

Original languageEnglish
Title of host publication2025 9th International Conference on System Reliability and Safety, ICSRS 2025
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages163-169
Number of pages7
ISBN (Electronic)9798331549527
DOIs
StatePublished - 2025
Event9th International Conference on System Reliability and Safety, ICSRS 2025 - Turin, Italy
Duration: 26 Nov 202528 Nov 2025

Publication series

Name2025 9th International Conference on System Reliability and Safety, ICSRS 2025

Conference

Conference9th International Conference on System Reliability and Safety, ICSRS 2025
Country/TerritoryItaly
CityTurin
Period26/11/2528/11/25

Keywords

  • dependency
  • electronic system
  • modeling method
  • structural reliability

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