TY - GEN
T1 - The signal integrity design and simulation of triple modular redundant (TMR) computer
AU - Zheng, Pan
AU - Zheng, Qi
AU - Zeng, Zhankui
AU - Yang, Liman
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - This paper analyzes the problem of Signal Integrity in the design of high speed communication between modules of Triple Modular Redundant(TMR) computer, from the detrimental effect caused by Reflection and Simultaneous Switching Noise (SSN). And, the simulation with the whole computer is tested and verified. Then, the design of TMR computer is improved by the simulation. This paper proposes solutions from the layout, circuit design and signal link, etc. And the solutions are tested and verified. Its results show that the improvement effect is obvious and improve the stability and reliability of the TMR computer and meet the needs of signal integrity for the high speed communication modules of Triple Modular Redundant (TMR) Computer.
AB - This paper analyzes the problem of Signal Integrity in the design of high speed communication between modules of Triple Modular Redundant(TMR) computer, from the detrimental effect caused by Reflection and Simultaneous Switching Noise (SSN). And, the simulation with the whole computer is tested and verified. Then, the design of TMR computer is improved by the simulation. This paper proposes solutions from the layout, circuit design and signal link, etc. And the solutions are tested and verified. Its results show that the improvement effect is obvious and improve the stability and reliability of the TMR computer and meet the needs of signal integrity for the high speed communication modules of Triple Modular Redundant (TMR) Computer.
KW - Reflection
KW - Signal Integrity
KW - Simulation
KW - Simultaneous Switching Noise (SSN)
KW - Triple Modular Redundant (TMR) Computer
UR - https://www.scopus.com/pages/publications/85049214955
U2 - 10.1109/ICCIS.2017.8274874
DO - 10.1109/ICCIS.2017.8274874
M3 - 会议稿件
AN - SCOPUS:85049214955
T3 - 2017 IEEE International Conference on Cybernetics and Intelligent Systems, CIS 2017 and IEEE Conference on Robotics, Automation and Mechatronics, RAM 2017 - Proceedings
SP - 758
EP - 762
BT - 2017 IEEE International Conference on Cybernetics and Intelligent Systems, CIS 2017 and IEEE Conference on Robotics, Automation and Mechatronics, RAM 2017 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 8th IEEE International Conference on Cybernetics and Intelligent Systems, CIS 2017 and IEEE Conference on Robotics, Automation and Mechatronics, RAM 2017
Y2 - 19 November 2017 through 21 November 2017
ER -