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The Residual Strain Measurement of Thin Conductive Metal Wire after Electrical Failure with SEM Moiré

  • Yanjie Li
  • , Huimin Xie*
  • , Qinghua Wang
  • , Mengmeng Zhou
  • , Manqiong Xu
  • , Qiang Luo
  • , Changzhi Gu
  • *Corresponding author for this work
  • Tsinghua University
  • University of Jinan
  • National Institute of Advanced Industrial Science and Technology
  • CAS - Institute of Physics

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, the residual strain of a thin conductive metal wire on a polymer substrate after electrical failure is measured with SEM moire. Focused ion beam (FIB) milling is applied to fabricate micron moire gratings on the surfaces of constantan wires and the random phase shifting technique is used to process moire fringes. The virtual strain method is briefly introduced and used to calculate the real strain of specimens. In order to study the influence of a defect on the electrical failure of the constantan wire, experiments were conducted on two specimens, one with a crack, while the other one without any crack. By comparing the results, we found that the defect makes the critical beam current of electrical failure decrease. In addition, the specimens were subjected to compression after electrical failure, in agreement with the observed crack closure of the specimen. The successful results demonstrate that the moire method is effective to characterize the full-field deformation of constantan wires on the polymer membrane, and has a good potential for further application to the deformation measurement of thin films.

Original languageEnglish
Pages (from-to)371-378
Number of pages8
JournalActa Mechanica Solida Sinica
Volume29
Issue number4
DOIs
StatePublished - 2016
Externally publishedYes

Keywords

  • SEM moire
  • focused ion beam (FIB)
  • metal wire
  • residual strain

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