The PCB power/ground resonant impedance damping based on the cavity resonant model

  • Xiao Xiao Wang*
  • , Dong Lin Su
  • *Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The power bus structure in PCB or IC, which is consisting of two parallel planes separated by an insulator, behaves as a cavity resonator. The high resonant impedance at certain resonant frequency between the IC or PCB's power and ground layers is the cause of some signal integrity problems. Based on the theory of parallel planes cavity resonator, this paper deducts the relation functions between the resonant impedance, resonant frequency, resonant quality factor and the electromagnetic parameters of power/ground planes structure. By using the deductions above, this paper investigated 2 main new ways to reduce the resonant impedance, which are using magnetic substance or graphite as plane conductor material and adopting insulator material with high permittivity and loss tangent. And the effects of the two ways above in resonant impedance damping are expressed clearly by the simulation results.

Original languageEnglish
Title of host publicationISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings
Pages992-995
Number of pages4
StatePublished - 2006
Event2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006 - Guilin, China
Duration: 26 Oct 200629 Oct 2006

Publication series

NameISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings

Conference

Conference2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006
Country/TerritoryChina
CityGuilin
Period26/10/0629/10/06

Keywords

  • Parallel planes cavity resonant model
  • Power integrity
  • Power/ground parallel planes structure
  • Resonant impedance
  • Self-impedance
  • Simultaneous switching noise
  • Transfer impedance

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