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The effect of impedance matching to high-speed connector's signal integrity

  • Mingmin Zhao*
  • , Donglin Su
  • , Fei Dai
  • , Shenqing Kuang
  • , Xiaoxiao Wang
  • *Corresponding author for this work
  • BHU

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The high-speed interconnection solutions have been used in almost all electronic products, so connector's signal transmission quality has also become a critical factor in the design of high-speed applications. Thus, in the design of high-speed connector applications, the impedance matching, cross talk, propagating delay and alignment shape of connector are important factors to be considered. The impedance matching is the prerequisite for solving the signal integrity, this paper proposes the impedance matching rule of high-speed connector through theoretical calculation and software simulation, thereby effectively resolving the problem of signal integrity which impedance mismatching leads to.

Original languageEnglish
Title of host publicationISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings
Pages1280-1283
Number of pages4
StatePublished - 2006
Externally publishedYes
Event2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006 - Guilin, China
Duration: 26 Oct 200629 Oct 2006

Publication series

NameISAPE 2006 - 2006 7th International Symposium on Antennas, Propagation and EM Theory, Proceedings

Conference

Conference2006 7th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2006
Country/TerritoryChina
CityGuilin
Period26/10/0629/10/06

Keywords

  • High-speed connector
  • Impedance matching
  • Signal integrity

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