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The application of genetic algorithm for pin-fin heat sink optimization design

  • Yuying Wang*
  • , Yunze Li
  • , Dongxiao Liu
  • *Corresponding author for this work
  • Beihang University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The thermal management of electronic components will be challenging due to their continually rising of high heat flux densities but decreasing of sizes. The design of cooling equipments with simple configuration and high work efficiency is important for the whole system's work safety. In this paper fin-fin heat sink's work characteristics are calculated and the optimal design criterions are gained based on genetic algorithm (GA). A compositive optimization model that reflects the dynamic response and pressure drop traits is developed through the analysis of thermal capacity (Ct) and time constant (τ). Finally, results for the equipment's optimal design under different design strategies were got from the optimum calculation. Results show that optimization aimed at the compositive evaluate objective on the time constant τ and the pressure drop ΔP of the heat sink can lead to satisfactory effects. These results may provide references to designers and further research on micro-electronic components' cooling.

Original languageEnglish
Title of host publication2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009
Pages2816-2821
Number of pages6
DOIs
StatePublished - 2009
Event2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009 - Xi'an, China
Duration: 25 May 200927 May 2009

Publication series

Name2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009

Conference

Conference2009 4th IEEE Conference on Industrial Electronics and Applications, ICIEA 2009
Country/TerritoryChina
CityXi'an
Period25/05/0927/05/09

Keywords

  • Electronic components
  • Genetic algorithm (GA)
  • Optimization
  • Pin-fin heat sink
  • Pressure drop

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