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Temperature-humidity oriented reliability prediction for electronic equipments

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents a practical method of reliability prediction for electronic devices with operating temperature and relative humidity that will not always be in steady state. Since operating temperature (Tu) and relative humidity (RHu) are various in different regions, the authors use temperature probability distribution function f(Tu) to indicate the change of Tu, and humidity probability distribution function g(RHu) is used to indicate the variation of RHu. In order to estimate equipment reliability for the entire area of product usage, this paper uses these two functions to modify prediction model. The proposed method offers a way to predict the average value of failure rate for the entire area of product usage with accelerated test data and climate information.

Original languageEnglish
Title of host publicationICRMS'2011 - Safety First, Reliability Primary
Subtitle of host publicationProceedings of 2011 9th International Conference on Reliability, Maintainability and Safety
Pages149-153
Number of pages5
DOIs
StatePublished - 2011
Event2011 9th International Conference on Reliability, Maintainability and Safety: Safety First, Reliability Primary, ICRMS'2011 - Guiyang, China
Duration: 12 Jun 201115 Jun 2011

Publication series

NameICRMS'2011 - Safety First, Reliability Primary: Proceedings of 2011 9th International Conference on Reliability, Maintainability and Safety

Conference

Conference2011 9th International Conference on Reliability, Maintainability and Safety: Safety First, Reliability Primary, ICRMS'2011
Country/TerritoryChina
CityGuiyang
Period12/06/1115/06/11

Keywords

  • accelerated test
  • electronic devices
  • operating temperature
  • relative humidity
  • reliability prediction

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