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Surface monitoring for pitting evolution into uniform corrosion on Cu-Ni-Zn ternary alloy in alkaline chloride solution: ex-situ LCM and in-situ SECM

  • Decheng Kong
  • , Chaofang Dong*
  • , Zhaoran Zheng
  • , Feixiong Mao
  • , Aoni Xu
  • , Xiaoqing Ni
  • , Cheng Man
  • , Jizheng Yao
  • , Kui Xiao
  • , Xiaogang Li
  • *Corresponding author for this work
  • University of Science and Technology Beijing
  • Northeastern University China
  • Shanghai Research Institute of Materials

Research output: Contribution to journalArticlepeer-review

Abstract

The evolution of the corrosion process on Cu-Ni-Zn alloy in alkaline chloride solution was investigated by in-situ scanning electrochemical microscopy, X-ray photoelectron spectroscopy, and ex-situ laser confocal microscopy, and the effects of ambient temperature and polarization time were also discussed. The results demonstrated a higher pitting nucleation rate and lower pit growth rate at low temperature. The ratio of pit depth to mouth diameter decreased with increasing pit volume and temperature, indicating that pits preferentially propagate in the horizontal direction rather than the vertical direction owing to the presence of corrosion products and deposited copper. The surface current was uniform and stabilized at approximately 2.2 nA during the passive stage, whereas the current increased after the pits were formed with the maximum approaching 3 nA. Increasing the temperature led to an increase in porous corrosion products (CuO, Zn(OH) 2 , and Ni(OH) 2 ) and significantly increased the rate of transition from pitting to uniform corrosion. Dezincification corrosion was detected by energy dispersive spectrometry, and a mechanism for pitting transition into uniform corrosion induced by dezincification at the grain boundaries is proposed.

Original languageEnglish
Pages (from-to)245-257
Number of pages13
JournalApplied Surface Science
Volume440
DOIs
StatePublished - 15 May 2018
Externally publishedYes

Keywords

  • Cu-Ni-Zn alloy
  • Laser confocal microscopy
  • Pitting
  • Scanning electrochemical microscopy
  • X-ray photoelectron spectroscopy

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