@inproceedings{2b5dd6601d234de1af221fc08ea84997,
title = "Surface modification of single-crystal silicon by hybrid laser treatment",
abstract = "In this paper, recent work on picosecond and nanosecond hybrid laser treatment of mechanically sawed single-crystal silicon wafer is presented. Surface morphology, surface roughness and phase development has been analyzed by 3D laser scanning confocal microscope (LSCM), X-ray diffraction (XRD), and scanning electron microscope (SEM). Results show that as-received surface defects including SiO2 layer and saw-mark defects have been significantly reduced, while average surface roughness has been decreased. No obvious damages such as micro-cracks and micropores have been observed at the laser-treated surface. Moreover, residual stress and electrical resistivity of laser-treated surface has been measured, respectively. The insights obtained in this work provide a facile method to improve surface quality of mechanically machined silicon wafer.",
keywords = "Laser Processing, Properties, Single-Crystal Silicon Wafer, Surface Modification",
author = "Xinxin Li and Zhiquan Cui and Yingchun Guan",
note = "Publisher Copyright: {\textcopyright} 2022 SPIE; 13th International Photonics and OptoElectronics Meetings, POEM 2021 ; Conference date: 06-11-2021 Through 08-11-2021",
year = "2022",
doi = "10.1117/12.2626902",
language = "英语",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Xinliang Zhang and Perry Shum and Jianji Dong",
booktitle = "13th International Photonics and OptoElectronics Meetings, POEM 2021",
address = "美国",
}