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Surface and subsurface response to the in-situ laser assistance in ultra-precision diamond turning of SiCp/Al composites

  • Yuhan Li
  • , Hanheng Du
  • , Wai Sze Yip*
  • , Cheung tong Cheng
  • , Yan Zhou
  • , Jieqiong Lin
  • , Suet To*
  • *Corresponding author for this work
  • Hong Kong Polytechnic University
  • Changchun University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

This study focuses on the application of in-situ laser-assisted single-point diamond turning (ILAT) on SiCp/Al metal matrix composites (MMCs), renowned for their exceptional mechanical properties and difficult-to-cut nature. The surface and subsurface response to the in-situ laser assistance under a small uncut chip thickness (UCT) is investigated. The results demonstrate that appropriate laser energy can reduce subsurface crystal defects while maintaining surface quality during machining. As the laser power increases, the surface damage pattern shifts from cut-through to fracture, eventually leading to severe matrix deformation. Slight compressive stress is observed on the Al phase of surfaces machined with either conventional single-point diamond turning (SPDT) or ILAT. Al crystals near the machined surface and SiC particles in the SPDT sample exhibit a notable accumulation of dislocations. Laser assistance is beneficial for mitigating dislocations and improving the crystalline integrity of Al grains, while Al grains close to the machined surface in both SPDT and ILAT samples present comparable amounts of stacking faults. The findings enhance the understanding of surface and subsurface generation of SiCp/Al composites in ILAT, providing a reference for the application of ILAT on other MMCs.

Original languageEnglish
Pages (from-to)7160-7170
Number of pages11
JournalJournal of Materials Research and Technology
Volume30
DOIs
StatePublished - 1 May 2024
Externally publishedYes

Keywords

  • In-situ laser-assisted machining
  • Metal matrix composite
  • Micro cutting of inhomogeneous materials
  • Single point diamond turning
  • Subsurface damages

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