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Surface analysis of silver-plated circuit boards in a salt-spray environment

  • Lidan Yan
  • , Kui Xiao*
  • , Pan Yi
  • , Chaofang Dong
  • , Junsheng Wu
  • , Chengliang Mao
  • , Xiaogang Li
  • *Corresponding author for this work
  • University of Science and Technology Beijing

Research output: Contribution to journalArticlepeer-review

Abstract

By conducting salt-spray tests, we studied the corrosion behaviour and mechanism of printed circuit boards with an immersion Ag surface finish (PCB-ImAg) in polluted environments that contain SO2and Cl. The polluted environment was similar to the polluted marine atmosphere environment in Qingdao China. A comparison of micrographs of the test specimens revealed that the test specimens containing SO2and Clsuffered more serious damage. The entire corrosion process resulted in unevenly distributed partial corrosion products at the initial stage. However, this distribution gradually became uniform. The Raman spectroscopic analysis results for the test specimens containing SO2and Clshow that the corrosion products mainly comprised Cu4(OH)6SO4, Cu2Cl(OH)3, Cu2O, Ag2O, Ag2CO3, Ag2SO3and Ag2SO4.

Original languageEnglish
Pages (from-to)301-312
Number of pages12
JournalJournal of Alloys and Compounds
Volume688
DOIs
StatePublished - 2016
Externally publishedYes

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 14 - Life Below Water
    SDG 14 Life Below Water

Keywords

  • Failure mechanism
  • Raman spectroscopy
  • Salt-spray environment corrosion
  • Silver-plated circuit boards

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