Study on thermal expansion pressure and resin pressure variation during thermal expansion molding process

C. Xin; Y. Gu; M. Li; Y. Li; Z. Zhang

Study on thermal expansion pressure and resin pressure variation during thermal expansion molding process

C. Xin
, Y. Gu^*
, M. Li
, Y. Li
, Z. Zhang

^*Corresponding author for this work

School of Materials Science and Engineering

Beihang University

Research output: Contribution to conference › Paper › peer-review

Abstract

The effects of temperature cycle and process gap on the thermal expansion pressure and resin pressure were investigated. It indicates that the process gap influences magnitude of expansion pressure and the moment of generating pressure. The temperature cycle with lower temperature plateau can effectively reduce the gradient inside the mold.

Original language	English
State	Published - 2011
Event	18th International Conference on Composites Materials, ICCM 2011 - Jeju, Korea, Republic of Duration: 21 Aug 2011 → 26 Aug 2011

Conference

Conference	18th International Conference on Composites Materials, ICCM 2011
Country/Territory	Korea, Republic of
City	Jeju
Period	21/08/11 → 26/08/11

Keywords

Process gap
Resin pressure
Thermal expansion molding
Thermal expansion pressure

Cite this

@conference{484bce92ba034701879492dddd5057bd,

title = "Study on thermal expansion pressure and resin pressure variation during thermal expansion molding process",

abstract = "The effects of temperature cycle and process gap on the thermal expansion pressure and resin pressure were investigated. It indicates that the process gap influences magnitude of expansion pressure and the moment of generating pressure. The temperature cycle with lower temperature plateau can effectively reduce the gradient inside the mold.",

keywords = "Process gap, Resin pressure, Thermal expansion molding, Thermal expansion pressure",

author = "C. Xin and Y. Gu and M. Li and Y. Li and Z. Zhang",

year = "2011",

language = "英语",

note = "18th International Conference on Composites Materials, ICCM 2011 ; Conference date: 21-08-2011 Through 26-08-2011",

}

TY - CONF

T1 - Study on thermal expansion pressure and resin pressure variation during thermal expansion molding process

AU - Xin, C.

AU - Gu, Y.

AU - Li, M.

AU - Li, Y.

AU - Zhang, Z.

PY - 2011

Y1 - 2011

N2 - The effects of temperature cycle and process gap on the thermal expansion pressure and resin pressure were investigated. It indicates that the process gap influences magnitude of expansion pressure and the moment of generating pressure. The temperature cycle with lower temperature plateau can effectively reduce the gradient inside the mold.

AB - The effects of temperature cycle and process gap on the thermal expansion pressure and resin pressure were investigated. It indicates that the process gap influences magnitude of expansion pressure and the moment of generating pressure. The temperature cycle with lower temperature plateau can effectively reduce the gradient inside the mold.

KW - Process gap

KW - Resin pressure

KW - Thermal expansion molding

KW - Thermal expansion pressure

UR - https://www.scopus.com/pages/publications/85076870708

M3 - 论文

AN - SCOPUS:85076870708

T2 - 18th International Conference on Composites Materials, ICCM 2011

Y2 - 21 August 2011 through 26 August 2011

ER -

Study on thermal expansion pressure and resin pressure variation during thermal expansion molding process

Abstract

Conference

Keywords

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