Study on rheological behavior of EPON862 epoxy resin system using resin transfer molding process

  • Z. Y. Liang*
  • , Y. X. Duan
  • , Y. Lin
  • , X. Y. Fan
  • , Z. G. Zhang
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The rheological behavior of EPON862 epoxy resin system using resin transfer molding (RTM) process was studied with DSC analysis and viscosity experiments. A rheological model based on dual-Arrhenius equation was established and used to simulate rheological behavior of the resin. The estimated viscosity of the model is in good agreement with that of experiment. The processing window of the resin system can be well determined for the process based on the model. The optimum processing temperature of the resin for RTM process is 50°C, at which the resin can keep the viscosity less than 300 cP for 50 min. The model is important for performing simulation and quality control of RTM process for high performance composites.

Original languageEnglish
Pages (from-to)16-19
Number of pages4
JournalFuhe Cailiao Xuebao/Acta Materiae Compositae Sinica
Volume18
Issue number1
StatePublished - Feb 2001

Keywords

  • Composites
  • Epoxy
  • Resin transfer molding
  • Rheological model

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