Structural design and ANSYS thermal simulation for semiconductor laser system

Conventional semiconductor laser technology always chooses a separate design with its controller system, so that the semiconductor laser volume can not be compressed any more. Meanwhile, the integrated structure of the semiconductor laser has serious radiation heat. To overcome the problems mentioned above, this paper proposes a new design method of the semiconductor laser for its integration and miniaturization. To guarantee the laser to be operated stably and to show good thermal management, the ANSYS software is used to perform a thermal simulation for the high-density components such as Print Circuit Board (PCB) to improve the structure reliability before the structure manufacturing. Simulation experiments indicate that designed novel structure allows the semiconductor laser to integrate with the drive controller., and has uniform temperature distribution and an appropriate space, and can guarantee the laser to operate stably. The whole sizes of the semiconductor is only 85 mm×95 mm×115 mm. Moreover, the appropriate space is left in the structure of the semiconductor, which is conductive to the design of a collimated light path for its future applications.