@inproceedings{a2afb5cae2eb4786a33e25a2975f20fb,
title = "Steady-state thermal analysis and layout optimization of DC/DC converter",
abstract = "DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this paper. In order to obtain power module temperature field contours at different temperature levels, a simplified 3D model of the power module was built, and steady-state thermal analysis was completed. The layout of the converter is optimized to reduce and balance heat distribution according to analysis results. The simulation results indicate that rational distribution of the power supply module can improve the reliability of DC/DC converters significantly.",
keywords = "DC/DC converters, layout optimization, reliability, steady-state thermal analysis",
author = "Cheng Gao and Haitian Liu and Jiaoying Huang and Shenglong Diao",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 Prognostics and System Health Management Conference, PHM 2014 ; Conference date: 24-08-2014 Through 27-08-2014",
year = "2014",
month = dec,
day = "16",
doi = "10.1109/PHM.2014.6988203",
language = "英语",
series = "Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "405--409",
booktitle = "Proceedings of 2014 Prognostics and System Health Management Conference, PHM 2014",
address = "美国",
}