TY - GEN
T1 - Simulation of pb-free solder bumps under thermal-electric coupling conditions
AU - Yuan, Jiaxin
AU - Zhang, Sujuan
AU - Jiang, Maogong
AU - Fu, Guicui
N1 - Publisher Copyright:
© ESREL2020-PSAM15 Organizers. Published by Research Publishing, Singapore.
PY - 2020
Y1 - 2020
N2 - With the development of microelectronic packaging technology and the Pb-free process of electronic products, it is important to study the reliability of Pb-free solder bumps under thermal-electric coupling conditions to improve the operational reliability of Pb-free components. This paper proposes a simulation method of Pb-free solder bumps to simplify the analysis process and reduce costs, offering a guiding significance to the reliability assessment of electronic components. First, based on the theory of atomic migration and vacancy exchange mechanism, considering three driving forces of “electron wind”, temperature gradient and stress gradient, a numerical algorithm of atomic migration void prediction is put forward. Next, using ANSYS parametric design language (APDL) and Matlab program as the carrier, a finite element analysis method of void evolution simulation is established. Then, selecting Sn3.0Ag0.5Cu Pb-free solder bumps in the chip-scale package (CSP) as the research object, the void nucleation and growth process of solder bumps under thermal-electric coupling conditions is simulated, and the void evolution simulation result of bumps is given. It can be proved that this simulation method can effectively predict the process of void formation and evolution.
AB - With the development of microelectronic packaging technology and the Pb-free process of electronic products, it is important to study the reliability of Pb-free solder bumps under thermal-electric coupling conditions to improve the operational reliability of Pb-free components. This paper proposes a simulation method of Pb-free solder bumps to simplify the analysis process and reduce costs, offering a guiding significance to the reliability assessment of electronic components. First, based on the theory of atomic migration and vacancy exchange mechanism, considering three driving forces of “electron wind”, temperature gradient and stress gradient, a numerical algorithm of atomic migration void prediction is put forward. Next, using ANSYS parametric design language (APDL) and Matlab program as the carrier, a finite element analysis method of void evolution simulation is established. Then, selecting Sn3.0Ag0.5Cu Pb-free solder bumps in the chip-scale package (CSP) as the research object, the void nucleation and growth process of solder bumps under thermal-electric coupling conditions is simulated, and the void evolution simulation result of bumps is given. It can be proved that this simulation method can effectively predict the process of void formation and evolution.
KW - Atomic migration
KW - Finite element simulation
KW - Pb-free solder bumps
KW - Reliability
KW - Thermal- electric coupling
KW - Void evolution
UR - https://www.scopus.com/pages/publications/85107308069
U2 - 10.3850/978-981-14-8593-0_5247-cd
DO - 10.3850/978-981-14-8593-0_5247-cd
M3 - 会议稿件
AN - SCOPUS:85107308069
SN - 9789811485930
T3 - Proceedings of the 30th European Safety and Reliability Conference and the 15th Probabilistic Safety Assessment and Management Conference
SP - 1628
EP - 1634
BT - Proceedings of the 30th European Safety and Reliability Conference and the 15th Probabilistic Safety Assessment and Management Conference
A2 - Baraldi, Piero
A2 - Di Maio, Francesco
A2 - Zio, Enrico
PB - Research Publishing, Singapore
T2 - 30th European Safety and Reliability Conference, ESREL 2020 and 15th Probabilistic Safety Assessment and Management Conference, PSAM15 2020
Y2 - 1 November 2020 through 5 November 2020
ER -