Simulation assisted FMEA of electronic product

Xiaoqin Zhang; Ying Chen; Xiang Ma; Rui Kang

doi:10.1109/PHM.2012.6228912

Simulation assisted FMEA of electronic product

Xiaoqin Zhang^*
, Ying Chen
, Xiang Ma
, Rui Kang

^*Corresponding author for this work

School of Reliability and Systems Engineering

Beihang University

Research output: Contribution to conference › Paper › peer-review

4 Scopus citations

Abstract

Traditional FMEA method is difficult to carry out when products haven't enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure's effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.

Original language	English
DOIs	https://doi.org/10.1109/PHM.2012.6228912
State	Published - 2012
Event	2012 3rd Annual IEEE Prognostics and System Health Management Conference, PHM-2012 - Beijing, China Duration: 23 May 2012 → 25 May 2012

Conference

Conference	2012 3rd Annual IEEE Prognostics and System Health Management Conference, PHM-2012
Country/Territory	China
City	Beijing
Period	23/05/12 → 25/05/12

Keywords

FMEA
circuit simulation
thermal analysis
vibration analysis

Access to Document

10.1109/PHM.2012.6228912

Cite this

@conference{722b3f8a004f401ba33d031ac52407b0,

title = "Simulation assisted FMEA of electronic product",

abstract = "Traditional FMEA method is difficult to carry out when products haven't enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure's effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.",

keywords = "FMEA, circuit simulation, thermal analysis, vibration analysis",

author = "Xiaoqin Zhang and Ying Chen and Xiang Ma and Rui Kang",

year = "2012",

doi = "10.1109/PHM.2012.6228912",

language = "英语",

note = "2012 3rd Annual IEEE Prognostics and System Health Management Conference, PHM-2012 ; Conference date: 23-05-2012 Through 25-05-2012",

}

TY - CONF

T1 - Simulation assisted FMEA of electronic product

AU - Zhang, Xiaoqin

AU - Chen, Ying

AU - Ma, Xiang

AU - Kang, Rui

PY - 2012

Y1 - 2012

N2 - Traditional FMEA method is difficult to carry out when products haven't enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure's effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.

AB - Traditional FMEA method is difficult to carry out when products haven't enough failure information and engineers are lack of experience. A new simulation assisted FMEA method is proposed to solve this problem and the detail procedure is introduced. Stress simulation is done to give the information of local stress and help to find more possible failure modes and weakness point. In order to evaluate the effect of some complicated failure modes, failure injection technology is used to simulate each failure's effect. Case study of FMEA of an aviation data processing device is performed. Results show that it will be helpful in finding more failures and properly evaluate their effect.

KW - FMEA

KW - circuit simulation

KW - thermal analysis

KW - vibration analysis

UR - https://www.scopus.com/pages/publications/84866162501

U2 - 10.1109/PHM.2012.6228912

DO - 10.1109/PHM.2012.6228912

M3 - 论文

AN - SCOPUS:84866162501

T2 - 2012 3rd Annual IEEE Prognostics and System Health Management Conference, PHM-2012

Y2 - 23 May 2012 through 25 May 2012

ER -

Simulation assisted FMEA of electronic product

Abstract

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this