TY - GEN
T1 - Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill
AU - Zeng, Qinghua
AU - Guan, Yong
AU - Su, Fei
AU - Chen, Jing
AU - Jin, Yufeng
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/2/17
Y1 - 2016/2/17
N2 - This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer chip stack, silicon interposer, solder balls and PCB board. Silicon chips with TSVs are vertically stacked by micro-bumps of Cu-Sn. It is revealed that the chip deformation is increased while the reliability of the micro-bumps are decreased. For applications undergoing heavy thermal cycles, it is not suggested to include underfill in the 3D-TSV stack. The necessity of definition of viscoelasticity properties rather than simplified elasticity is also affirmed by comparison.
AB - This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature-dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer chip stack, silicon interposer, solder balls and PCB board. Silicon chips with TSVs are vertically stacked by micro-bumps of Cu-Sn. It is revealed that the chip deformation is increased while the reliability of the micro-bumps are decreased. For applications undergoing heavy thermal cycles, it is not suggested to include underfill in the 3D-TSV stack. The necessity of definition of viscoelasticity properties rather than simplified elasticity is also affirmed by comparison.
UR - https://www.scopus.com/pages/publications/84977675427
U2 - 10.1109/EPTC.2015.7412386
DO - 10.1109/EPTC.2015.7412386
M3 - 会议稿件
AN - SCOPUS:84977675427
T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC
BT - 2015 IEEE 17th Electronics Packaging and Technology Conference, EPTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015
Y2 - 2 December 2015 through 4 December 2015
ER -