@inproceedings{2bdc23cec6634932a2fb175101c24d25,
title = "Simulation Analysis of Temperature Effects on Plate-Structure Modal Behavior",
abstract = "Temperature can affect the modal characteristics of a structure, on one hand by influencing the modal characteristics through the properties of the material, and on the other hand by applying thermal stress within the structure to affect the modal characteristics. This paper selected three different plate structures and conducted finite element simulation analyses on these two aspects, comparing their impact on the modal characteristics. Additionally, the inherent frequency characteristics of the three plate structures were compared under a non-uniform temperature field, providing a reference for practical engineering selection.",
keywords = "finite element simulation, modal, plate-structure, temperature",
author = "Pengcheng Lv and Xiaogang Li and Zhongda Sun and Weiwei Hu",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024 ; Conference date: 31-07-2024 Through 02-08-2024",
year = "2024",
doi = "10.1109/ICRMS63553.2024.00159",
language = "英语",
series = "Proceedings - 2024 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "997--1004",
booktitle = "Proceedings - 2024 15th International Conference on Reliability, Maintenance and Safety, ICRMS 2024",
address = "美国",
}