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Self-compliance unipolar resistive switching and mechanism of Cu/SiO 2/TiN RRAM devices

  • D. Yu*
  • , L. F. Liu
  • , P. Huang
  • , F. F. Zhang
  • , B. Chen
  • , B. Gao
  • , Y. Hou
  • , D. D. Han
  • , Y. Wang
  • , J. F. Kang
  • , X. Zhang
  • *Corresponding author for this work
  • Peking University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

CMOS compatible Cu/SiO 2/TiN-based resistive random access memory (RRAM) was fabricated and investigated. Unique self-compliance unipolar resistive switching (RS) was observed, as well as good retention and uniformity of resistance states. A physical model based on formation and rupture of Cu conductive filament (CF) is proposed, considering both thermal and electrical effect, and verified by experiments.

Original languageEnglish
Title of host publication2012 IEEE Silicon Nanoelectronics Workshop, SNW 2012
DOIs
StatePublished - 2012
Externally publishedYes
Event2012 17th IEEE Silicon Nanoelectronics Workshop, SNW 2012 - Honolulu, HI, United States
Duration: 10 Jun 201211 Jun 2012

Publication series

Name2012 IEEE Silicon Nanoelectronics Workshop, SNW 2012

Conference

Conference2012 17th IEEE Silicon Nanoelectronics Workshop, SNW 2012
Country/TerritoryUnited States
CityHonolulu, HI
Period10/06/1211/06/12

Keywords

  • RRAM
  • SiO
  • unipolar switching

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