TY - GEN
T1 - Robust implantable blood pressure sensor packaging for long-term laboratory animals monitoring
AU - Chen, Xing
AU - Young, Darrin
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/1/5
Y1 - 2016/1/5
N2 - A robust implantable blood pressure sensor packaging technique is demonstrated for long-term laboratory animals monitoring. The packaged sensors achieve a lifetime over 100 days in PBS solution at 37 °C, adequate for the proposed implantable application for life sciences research. The proposed packaging technique employs a multi-layer of Parylene and PDMS coating over a MEMS piezoresistive pressure sensor, thus effectively slowing down the moisture penetration and electrochemical etching of the metal traces on sensor surface or PCB surface under a bias condition. Further analysis of experimental results reveals a strong relationship between lifetime of packaged sensors and bias voltage level, suggesting a design trade-off between system sensitivity and reliability.
AB - A robust implantable blood pressure sensor packaging technique is demonstrated for long-term laboratory animals monitoring. The packaged sensors achieve a lifetime over 100 days in PBS solution at 37 °C, adequate for the proposed implantable application for life sciences research. The proposed packaging technique employs a multi-layer of Parylene and PDMS coating over a MEMS piezoresistive pressure sensor, thus effectively slowing down the moisture penetration and electrochemical etching of the metal traces on sensor surface or PCB surface under a bias condition. Further analysis of experimental results reveals a strong relationship between lifetime of packaged sensors and bias voltage level, suggesting a design trade-off between system sensitivity and reliability.
KW - blood pressure sensor
KW - implantable biomedical devices
KW - long-term reliability
KW - polymeric packaging
UR - https://www.scopus.com/pages/publications/85010952148
U2 - 10.1109/ICSENS.2016.7808969
DO - 10.1109/ICSENS.2016.7808969
M3 - 会议稿件
AN - SCOPUS:85010952148
T3 - Proceedings of IEEE Sensors
BT - IEEE Sensors, SENSORS 2016 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 15th IEEE Sensors Conference, SENSORS 2016
Y2 - 30 October 2016 through 2 November 2016
ER -