Rheological behaviors and viscosity model of bisphnol-A epoxy/DDS resin system

Feng Shi; Yue Xin Duan; Xiu Ni Zeng; Zhi Yong Liang; Zuo Guang Zhang

Rheological behaviors and viscosity model of bisphnol-A epoxy/DDS resin system

Feng Shi^*
, Yue Xin Duan
, Xiu Ni Zeng
, Zhi Yong Liang
, Zuo Guang Zhang

^*Corresponding author for this work

School of Materials Science and Engineering

Beihang University
High-Performance Materials Institute, Florida State University

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is developed to predict resin rheological behavior of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes.

Original language	English
Pages (from-to)	610-616
Number of pages	7
Journal	Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica
Volume	26
Issue number	5
State	Published - Sep 2005

Keywords

Bisphnol-A epoxy resin
Processing window
Reaction curing agent
Viscosity model

Cite this

@article{83bdb5de50904353bab72d74e3c0c3a5,

title = "Rheological behaviors and viscosity model of bisphnol-A epoxy/DDS resin system",

abstract = "The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is developed to predict resin rheological behavior of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes.",

keywords = "Bisphnol-A epoxy resin, Processing window, Reaction curing agent, Viscosity model",

author = "Feng Shi and Duan, \{Yue Xin\} and Zeng, \{Xiu Ni\} and Liang, \{Zhi Yong\} and Zhang, \{Zuo Guang\}",

year = "2005",

month = sep,

language = "英语",

volume = "26",

pages = "610--616",

journal = "Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica",

issn = "1000-6893",

publisher = "Chinese Society of Astronautics",

number = "5",

}

TY - JOUR

T1 - Rheological behaviors and viscosity model of bisphnol-A epoxy/DDS resin system

AU - Shi, Feng

AU - Duan, Yue Xin

AU - Zeng, Xiu Ni

AU - Liang, Zhi Yong

AU - Zhang, Zuo Guang

PY - 2005/9

Y1 - 2005/9

N2 - The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is developed to predict resin rheological behavior of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes.

AB - The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is developed to predict resin rheological behavior of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes.

KW - Bisphnol-A epoxy resin

KW - Processing window

KW - Reaction curing agent

KW - Viscosity model

UR - https://www.scopus.com/pages/publications/33645634196

M3 - 文章

AN - SCOPUS:33645634196

SN - 1000-6893

VL - 26

SP - 610

EP - 616

JO - Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica

JF - Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica

IS - 5

ER -

Rheological behaviors and viscosity model of bisphnol-A epoxy/DDS resin system

Abstract

Keywords

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