TY - GEN
T1 - Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array
AU - Kang, Ting
AU - Yan, Zhaowen
AU - Wei, Zhang
AU - Wang, Jianwei
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/7/12
Y1 - 2016/7/12
N2 - Since more chips are fabricated within 3D-IC, the single layer TSV cannot satisfy the requirement. Hence, the multilayer TSV structure was proposed, and the influence of different bump radius, bump height, underfill material in the intermetallic layer on the TSV performance was studied. In reality, multilayer TSV array is applied in the product. Therefore two multilayer 4 × 4 TSV arrays have been proposed with different GS distribution. The coupling analysis was performed and the effect of ground TSV was studied.
AB - Since more chips are fabricated within 3D-IC, the single layer TSV cannot satisfy the requirement. Hence, the multilayer TSV structure was proposed, and the influence of different bump radius, bump height, underfill material in the intermetallic layer on the TSV performance was studied. In reality, multilayer TSV array is applied in the product. Therefore two multilayer 4 × 4 TSV arrays have been proposed with different GS distribution. The coupling analysis was performed and the effect of ground TSV was studied.
KW - 3D integration
KW - multilayer TSV
KW - multilayer TSV array
KW - through silicon via (TSV)
UR - https://www.scopus.com/pages/publications/84981297932
U2 - 10.1109/MAPE.2015.7510408
DO - 10.1109/MAPE.2015.7510408
M3 - 会议稿件
AN - SCOPUS:84981297932
T3 - 2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies, MAPE 2015
SP - 674
EP - 677
BT - 2015 IEEE 6th International Symposium on Microwave, Antenna, Propagation, and EMC Technologies, MAPE 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th IEEE International Symposium on Microwave, Antenna, Propagation, and EMC Technologies, MAPE 2015
Y2 - 28 October 2015 through 30 October 2015
ER -