TY - GEN
T1 - Research on reliability evaluation method of fan-out package based on sub-model
AU - Liu, Qingsheng
AU - Wan, Bo
AU - Zhang, Zhongqing
AU - Fu, Guicui
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - As a kind of advanced packaging, fan-out package has great advantages in 5G and intelligent wearable fields because of its small package size, short interconnection and high performance. It is also considered as one of the means to achieve beyond Moore's law. Compared with traditional packaging devices, fan-out packaging devices have more complex and refined internal structure. Using traditional finite element analysis method for modeling and analysis can not obtain more accurate simulation results, and it takes a long time. Therefore, a reliability evaluation method of fan-out package based on sub-model method is studied in this paper. Firstly, COMSOL Multiphysics is used to build the main-model of the fan-out packaging device, and the dangerous solder joint position of the device is analyzed. Secondly, the whole field displacement of the fan-out packaging device after heating is measured by digital image correlation technology, and the main-model is verified. Thirdly, the sub-model of dangerous solder joint is established, and the accurate simulation results are obtained. Finally, based on the sub-model simulation results, the thermal fatigue life of typical fan out packaging devices is given by Darveaux model.
AB - As a kind of advanced packaging, fan-out package has great advantages in 5G and intelligent wearable fields because of its small package size, short interconnection and high performance. It is also considered as one of the means to achieve beyond Moore's law. Compared with traditional packaging devices, fan-out packaging devices have more complex and refined internal structure. Using traditional finite element analysis method for modeling and analysis can not obtain more accurate simulation results, and it takes a long time. Therefore, a reliability evaluation method of fan-out package based on sub-model method is studied in this paper. Firstly, COMSOL Multiphysics is used to build the main-model of the fan-out packaging device, and the dangerous solder joint position of the device is analyzed. Secondly, the whole field displacement of the fan-out packaging device after heating is measured by digital image correlation technology, and the main-model is verified. Thirdly, the sub-model of dangerous solder joint is established, and the accurate simulation results are obtained. Finally, based on the sub-model simulation results, the thermal fatigue life of typical fan out packaging devices is given by Darveaux model.
KW - Digital image correlation technology
KW - Fan-out package
KW - Finite element analysis
KW - Sub-model
UR - https://www.scopus.com/pages/publications/85123425513
U2 - 10.1109/PHM-Nanjing52125.2021.9613073
DO - 10.1109/PHM-Nanjing52125.2021.9613073
M3 - 会议稿件
AN - SCOPUS:85123425513
T3 - 2021 Global Reliability and Prognostics and Health Management, PHM-Nanjing 2021
BT - 2021 Global Reliability and Prognostics and Health Management, PHM-Nanjing 2021
A2 - Guo, Wei
A2 - Li, Steven
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th IEEE Global Reliability and Prognostics and Health Management, PHM-Nanjing 2021
Y2 - 15 October 2021 through 17 October 2021
ER -