TY - GEN
T1 - Research on Probabilistic Failure Physical Model of BGA Solder Joints in Multiple Fields Coupling
AU - Li, Sufen
AU - Sun, Yufeng
AU - Li, Xiaoxiao
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2019/1/4
Y1 - 2019/1/4
N2 - Ball Grid Array (BGA) solder joints are often subjected to temperature stress and vibration stress at the same time during the service process. The failure of such solder joints under multi-field coupling is a major problem in long-term evaluation of solder joint life. To couple the creep damage and fatigue damage of solder joints, a nonlinear damage accumulation method is proposed in this paper. And based on the creep damage model and fatigue damage model of BGA solder joint under continuous damage mechanics, a creep-fatigue coupled failure physical model of BGA solder joint is established. In addition, a Bayesian updating method combining model parameters with variables is proposed to realize the probabilization of the coupled failure physical model. And a complete process of parameter probabilization is formed, which provides theoretical guidance for the probability of the model in high dimension. What's more, the model is verified by temperature-vibration coupling experiment of single solder joint specimen, which shows that the coupled failure physical model can predict the life of BGA solder joints effectively.
AB - Ball Grid Array (BGA) solder joints are often subjected to temperature stress and vibration stress at the same time during the service process. The failure of such solder joints under multi-field coupling is a major problem in long-term evaluation of solder joint life. To couple the creep damage and fatigue damage of solder joints, a nonlinear damage accumulation method is proposed in this paper. And based on the creep damage model and fatigue damage model of BGA solder joint under continuous damage mechanics, a creep-fatigue coupled failure physical model of BGA solder joint is established. In addition, a Bayesian updating method combining model parameters with variables is proposed to realize the probabilization of the coupled failure physical model. And a complete process of parameter probabilization is formed, which provides theoretical guidance for the probability of the model in high dimension. What's more, the model is verified by temperature-vibration coupling experiment of single solder joint specimen, which shows that the coupled failure physical model can predict the life of BGA solder joints effectively.
KW - BGA solder joint
KW - Coupling failure physical model
KW - Creep damage model
KW - Fatigue damage model
KW - Probabilistic failure physical model
UR - https://www.scopus.com/pages/publications/85061775181
U2 - 10.1109/PHM-Chongqing.2018.00151
DO - 10.1109/PHM-Chongqing.2018.00151
M3 - 会议稿件
AN - SCOPUS:85061775181
T3 - Proceedings - 2018 Prognostics and System Health Management Conference, PHM-Chongqing 2018
SP - 845
EP - 850
BT - Proceedings - 2018 Prognostics and System Health Management Conference, PHM-Chongqing 2018
A2 - Ding, Ping
A2 - Li, Chuan
A2 - Yang, Shuai
A2 - Ding, Ping
A2 - Sanchez, Rene-Vinicio
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2018 Prognostics and System Health Management Conference, PHM-Chongqing 2018
Y2 - 26 October 2018 through 28 October 2018
ER -