Research on Low Power Thermal Management Technology of Stratospheric Airship Motor Controller

In order to solve the problem that the stratospheric airship works in a low temperature environment for a long time, the thermal insulation power consumption of the electronic equipment of the motor controller is too large, which brings a great burden to the energy system, the method of (Printed circuit boards, PCB) built-in heating copper wire is used to improve the heat source and the heat transfer path of the chip and realizes low power consumption of electronic equipment thermal management. The main chips of the airship controller are modeled in detail, and the heat transfer characteristics of the heat source and the chip are analysed, and the optimal heat source layout positions corresponding to different chips are obtained. The correctness of the conclusion and the accuracy of the simulation are verified by chip-level experiments. Based on the airship operating environment parameters, different heating powers are allocated according to the heat transfer characteristics and self heating power of different chips, and the PCB heating wiring design is completed. Compared with the traditional heating film heating method, the simulation results show that the PCB built-in heating layer method reduces the heating power by 60%.