TY - GEN
T1 - Research on interfacial diffusion reliability model of thin film thermocouple
AU - Lei, Dongyang
AU - Sun, Yufeng
AU - Xue, Yuqing
AU - Zhao, Guangyan
N1 - Publisher Copyright:
© 2021 Trans Tech Publications Ltd, Switzerland.
PY - 2021
Y1 - 2021
N2 - Thin film thermocouple (TFTC) is widely used in high temperature measurement, which is of short response time, less heat residual and integrated structure. Due to the ultra-thin structure of TFTC, the interfacial diffusion has a great influence on its reliability when exposed to high temperature environment, which leads to its performance degradation. Taking thermocouple on the turbine blade as research object, the parallel diffusion model of multilayer thermocouple is proposed based on Fick’s law. The reliability model of the protective layer, the sensitive layer and the insulating layer are established in the basis of the parallel diffusion model. According to the logical correlation among the multilayer films of TFTC, the TTF model of TFTC is given. Finally, an example of reliability model based on multilayer diffusion is simulated by Monte Carlo method, which demonstrates the feasibility of the method and model.
AB - Thin film thermocouple (TFTC) is widely used in high temperature measurement, which is of short response time, less heat residual and integrated structure. Due to the ultra-thin structure of TFTC, the interfacial diffusion has a great influence on its reliability when exposed to high temperature environment, which leads to its performance degradation. Taking thermocouple on the turbine blade as research object, the parallel diffusion model of multilayer thermocouple is proposed based on Fick’s law. The reliability model of the protective layer, the sensitive layer and the insulating layer are established in the basis of the parallel diffusion model. According to the logical correlation among the multilayer films of TFTC, the TTF model of TFTC is given. Finally, an example of reliability model based on multilayer diffusion is simulated by Monte Carlo method, which demonstrates the feasibility of the method and model.
KW - Interfacial diffusion
KW - MC simulation
KW - System reliability
KW - TFTC
UR - https://www.scopus.com/pages/publications/85105907569
U2 - 10.4028/www.scientific.net/KEM.881.77
DO - 10.4028/www.scientific.net/KEM.881.77
M3 - 会议稿件
AN - SCOPUS:85105907569
SN - 9783035737622
T3 - Key Engineering Materials
SP - 77
EP - 85
BT - Material Science and Engineering
A2 - Bhattacharyya, Debnath
A2 - Hu, X.Y.
PB - Trans Tech Publications Ltd
T2 - 7th International Conference on Material Science and Engineering, ICMSE 2020
Y2 - 18 December 2020 through 20 December 2020
ER -