TY - GEN
T1 - Reliability Analysis of Printed Circuit Boards Based on a Physics of Failure Simulation Method
AU - Song, Changliang
AU - Tang, Zebo
AU - Sun, Zhongchao
AU - Qian, Cheng
AU - Sun, Bo
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/11/23
Y1 - 2020/11/23
N2 - Printed Circuit Board (PCB) plays an essential role as a basic unit of electronic products to realize certain functions. Therefore, it is necessary to evaluate its reliability in an accurate way to promote the design improvement for electronic products. In this paper, a Physics of Failure (PoF) based reliability simulation on a PCB product is carried out by using the RISA-PofEra software developed by Beihang University, China. During the simulation analysis, thermal and vibration stress profiles over the PCB were exerted to provide inputs of a couple of PoF models for the reliability calculations of semiconductor devices on that PCB. Meanwhile, with the consideration on geometrical uncertainties in semiconductor packages, the Meantime Time to Failure (MTTF) of the PCB is calculated from the lifetimes of its weakest semiconductor device by using a Monte-Carlo method.
AB - Printed Circuit Board (PCB) plays an essential role as a basic unit of electronic products to realize certain functions. Therefore, it is necessary to evaluate its reliability in an accurate way to promote the design improvement for electronic products. In this paper, a Physics of Failure (PoF) based reliability simulation on a PCB product is carried out by using the RISA-PofEra software developed by Beihang University, China. During the simulation analysis, thermal and vibration stress profiles over the PCB were exerted to provide inputs of a couple of PoF models for the reliability calculations of semiconductor devices on that PCB. Meanwhile, with the consideration on geometrical uncertainties in semiconductor packages, the Meantime Time to Failure (MTTF) of the PCB is calculated from the lifetimes of its weakest semiconductor device by using a Monte-Carlo method.
UR - https://www.scopus.com/pages/publications/85099791530
U2 - 10.1109/SSLChinaIFWS51786.2020.9308849
DO - 10.1109/SSLChinaIFWS51786.2020.9308849
M3 - 会议稿件
AN - SCOPUS:85099791530
T3 - 2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020
SP - 274
EP - 279
BT - 2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020
Y2 - 23 November 2020 through 25 November 2020
ER -