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Principle and applications of segmented modeling method of via

  • Zhicai Ma*
  • , Zhaowen Yan
  • , Mingming Che
  • , Guochang Shi
  • *Corresponding author for this work
  • Beihang University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper adopts the segmented modeling method of via including the effect of power/ground plane pair. For this method, via structure is decomposed into three parts, and each part is modeled independently and then connected together. The extraction of the impedance of the power/ground plane pair Zpp is realized by using analytical formula, and then the impedance model Z pp is added into the equivalent circuit in the modeling of via. The modeling method is used to establish the model of via with decoupling capacitance and short-circuit via. Via with short column and complete switching via are also modeled using this method. The calculated results of the model match well with the simulation results of HFSS within 9 GHz, which demonstrates the effectiveness of the modeling method.

Original languageEnglish
Title of host publication2012 10th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2012
Pages710-713
Number of pages4
DOIs
StatePublished - 2012
Event2012 10th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2012 - Xi'an, China
Duration: 22 Oct 201226 Oct 2012

Publication series

Name2012 10th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2012

Conference

Conference2012 10th International Symposium on Antennas, Propagation and EM Theory, ISAPE 2012
Country/TerritoryChina
CityXi'an
Period22/10/1226/10/12

Keywords

  • complete switching via
  • decoupling capacitance
  • power/ground plane pair
  • short column
  • short-circuit via

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