Preparation of copper micro rod material with biolimited forming technology and electroless deposition

Jianhua Liu; Xin Liang; Songmei Li

Preparation of copper micro rod material with biolimited forming technology and electroless deposition

Jianhua Liu^*
, Xin Liang
, Songmei Li

^*Corresponding author for this work

School of Materials Science and Engineering

Beihang University

Research output: Contribution to journal › Article › peer-review

7 Scopus citations

Abstract

Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia (0.4-0.6 μm in diameter) surface were prepared by microbiological method and electroless deposition technology. It was found that the dispersion state of Nocadia in C₁₈H₂₉NaO₃S aqueous is better than that in Na₄P₂O₇ aqueous under the same other conditions. Nocadia dispersed in pre-processes solutions and electroless plating solutions on the synergistic action of C₁₈H₂₉NaO₃S and agitation. Nocadia remained their original rod shape during the electroless plating process. Copper micro rod material with nano-grain was obtained.

Original language	English
Pages (from-to)	557-560
Number of pages	4
Journal	Jinshu Xuebao/Acta Metallurgica Sinica
Volume	43
Issue number	5
State	Published - May 2007

Keywords

Biolimited forming technology
Copper micro rod
Electroless deposition
Micro-nano material
Nocadia

Cite this

@article{5ab421a8e44b4661a31135e3b6eb425e,

title = "Preparation of copper micro rod material with biolimited forming technology and electroless deposition",

abstract = "Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia (0.4-0.6 μm in diameter) surface were prepared by microbiological method and electroless deposition technology. It was found that the dispersion state of Nocadia in C18H29NaO3S aqueous is better than that in Na4P2O7 aqueous under the same other conditions. Nocadia dispersed in pre-processes solutions and electroless plating solutions on the synergistic action of C18H29NaO3S and agitation. Nocadia remained their original rod shape during the electroless plating process. Copper micro rod material with nano-grain was obtained.",

keywords = "Biolimited forming technology, Copper micro rod, Electroless deposition, Micro-nano material, Nocadia",

author = "Jianhua Liu and Xin Liang and Songmei Li",

year = "2007",

month = may,

language = "英语",

volume = "43",

pages = "557--560",

journal = "Jinshu Xuebao/Acta Metallurgica Sinica",

issn = "0412-1961",

publisher = "Chinese Academy of Sciences",

number = "5",

}

TY - JOUR

T1 - Preparation of copper micro rod material with biolimited forming technology and electroless deposition

AU - Liu, Jianhua

AU - Liang, Xin

AU - Li, Songmei

PY - 2007/5

Y1 - 2007/5

N2 - Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia (0.4-0.6 μm in diameter) surface were prepared by microbiological method and electroless deposition technology. It was found that the dispersion state of Nocadia in C18H29NaO3S aqueous is better than that in Na4P2O7 aqueous under the same other conditions. Nocadia dispersed in pre-processes solutions and electroless plating solutions on the synergistic action of C18H29NaO3S and agitation. Nocadia remained their original rod shape during the electroless plating process. Copper micro rod material with nano-grain was obtained.

AB - Copper micro rod materials with the coating thickness of 200 nm and the grain size of 20 nm on Nocadia (0.4-0.6 μm in diameter) surface were prepared by microbiological method and electroless deposition technology. It was found that the dispersion state of Nocadia in C18H29NaO3S aqueous is better than that in Na4P2O7 aqueous under the same other conditions. Nocadia dispersed in pre-processes solutions and electroless plating solutions on the synergistic action of C18H29NaO3S and agitation. Nocadia remained their original rod shape during the electroless plating process. Copper micro rod material with nano-grain was obtained.

KW - Biolimited forming technology

KW - Copper micro rod

KW - Electroless deposition

KW - Micro-nano material

KW - Nocadia

UR - https://www.scopus.com/pages/publications/34250343437

M3 - 文章

AN - SCOPUS:34250343437

SN - 0412-1961

VL - 43

SP - 557

EP - 560

JO - Jinshu Xuebao/Acta Metallurgica Sinica

JF - Jinshu Xuebao/Acta Metallurgica Sinica

IS - 5

ER -

Preparation of copper micro rod material with biolimited forming technology and electroless deposition

Abstract

Keywords

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