Abstract
A room temperature curing epoxy adhesive system was studied, which had high shear and peel strength between -150℃ and 100℃, and also excellent high and low temperature cycle resistance from liquid nitrogen temperature to 150℃. The optimum content of curing accelerator tris(dimethylaminomethyl)phenol was determined, and the influences of the curing time and post-curing on the curing degree, glass transition temperature and mechanical properties of the adhesives were also investigated. It is concluded that addition of tris(dimethylaminomethyl)phenol with proper content is good for improvements of the mechanical properties of the adhesive systems, and the curing degree and tensile strength are enhanced through post-curing which has little influence on the toughness of the cured adhesive systems. When the adhesive shear strength reaches a certain value, the increased curing degree and glass transition temperature in the adhesive systems via post-curing do not consequently result in the shear strength increased significantly.
| Original language | English |
|---|---|
| Pages (from-to) | 113-117 |
| Number of pages | 5 |
| Journal | Gaofenzi Cailiao Kexue Yu Gongcheng/Polymeric Materials Science and Engineering |
| Volume | 30 |
| Issue number | 12 |
| State | Published - 1 Dec 2014 |
Keywords
- Curing process
- Epoxy adhesive
- Room-temperature curing
- Structure adhesive
Fingerprint
Dive into the research topics of 'Preparation and properties of room temperature curing epoxy adhesive used in wide range of temperature'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver