Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

Lei Ding; Cong Wang; Yuanyuan Na; Lihua Chu; Jun Yan

doi:10.1016/j.scriptamat.2011.07.008

Preparation and near zero thermal expansion property of Mn ₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites

Lei Ding
, Cong Wang^*
, Yuanyuan Na
, Lihua Chu
, Jun Yan

^*Corresponding author for this work

School of Integrated Circuit Science and Engineering

Beihang University

Research output: Contribution to journal › Article › peer-review

66 Scopus citations

Abstract

In this work, Mn₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn ₃Cu_0.5A_0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10^-7 K^-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

Original language	English
Pages (from-to)	687-690
Number of pages	4
Journal	Scripta Materialia
Volume	65
Issue number	8
DOIs	https://doi.org/10.1016/j.scriptamat.2011.07.008
State	Published - Oct 2011

Keywords

Composites
MnXN/Cu
Near zero thermal expansion
Room temperature

Access to Document

10.1016/j.scriptamat.2011.07.008

Cite this

@article{937684f372ee43719f2e599f4091306f,

title = "Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites",

abstract = "In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.",

keywords = "Composites, MnXN/Cu, Near zero thermal expansion, Room temperature",

author = "Lei Ding and Cong Wang and Yuanyuan Na and Lihua Chu and Jun Yan",

year = "2011",

month = oct,

doi = "10.1016/j.scriptamat.2011.07.008",

language = "英语",

volume = "65",

pages = "687--690",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "8",

}

TY - JOUR

T1 - Preparation and near zero thermal expansion property of Mn 3Cu0.5A0.5N (A = Ni, Sn)/Cu composites

AU - Ding, Lei

AU - Wang, Cong

AU - Na, Yuanyuan

AU - Chu, Lihua

AU - Yan, Jun

PY - 2011/10

Y1 - 2011/10

N2 - In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

AB - In this work, Mn3Cu0.5A0.5N (A = Ni, Sn)/Cu composites with near zero thermal expansion property were successfully synthesized. It was found that the large positive thermal expansion of Cu can be effectively suppressed in the composite with the antiperovskite Mn 3Cu0.5A0.5N (A = Ni, Sn). In particular, the composites show almost zero thermal expansion with a coefficient of thermal expansion of 4.7 × 10-7 K-1 in the temperature range 290-320 K. We suggest that this offers a new alternative for metal matrix composites with low and near zero thermal expansion properties.

KW - Composites

KW - MnXN/Cu

KW - Near zero thermal expansion

KW - Room temperature

UR - https://www.scopus.com/pages/publications/80052268941

U2 - 10.1016/j.scriptamat.2011.07.008

DO - 10.1016/j.scriptamat.2011.07.008

M3 - 文章

AN - SCOPUS:80052268941

SN - 1359-6462

VL - 65

SP - 687

EP - 690

JO - Scripta Materialia

JF - Scripta Materialia

IS - 8

ER -

Preparation and near zero thermal expansion property of Mn ₃Cu_0.5A_0.5N (A = Ni, Sn)/Cu composites

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this