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Periodic topology optimization design for thermal conductive structure using ICM method

  • Kai Long*
  • , Jiao Jia
  • *Corresponding author for this work
  • North China Electric Power University
  • Key Laboratory of Lightweight and Reliability Technology for Engineering Vehicle
  • Changsha University of Science and Technology

Research output: Contribution to journal › Article › peer-review

Abstract

To obtain the optimal topological configuration for thermal conductive microstructures of composite materials, a topological optimization model of the periodic structure is established by the Independent Continuous Mapping method. In this model, minimized weight is taken as the objective and thermal compliance is the constraint condition. The thermal compliance constraint is approximately formulated using a first-order Taylor expansion. The image-filtering method is implemented by a partial differential equation to eliminate checkerboard patterns and mesh-dependence problems. To satisfy the periodic constraint, the designable domain is divided into a certain number of identical subdomains and the contribution coefficients of thermal compliance are redistributed. Optimal topological configurations with different periodic numbers and different loading conditions are compared and analyzed. Numerical results verify the validity of the proposed topology optimization method in designing the microstructures of composite materials for thermal conduction.

Original languageEnglish
Pages (from-to)227-235
Number of pages9
JournalGongcheng Lixue/Engineering Mechanics
Volume32
Issue number5
DOIs
StatePublished - 1 May 2015

Keywords

  • Continuum structure
  • Independent continuous mapping method
  • Periodic structure
  • Thermal conductivity
  • Topology optimization

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