PCB infrared thermal imaging diagnosis using support vector classifier

Jiuqing Wan; Xingshan Li

PCB infrared thermal imaging diagnosis using support vector classifier

Jiuqing Wan^*
, Xingshan Li

^*Corresponding author for this work

School of Automation Science and Electrical Engineering

Beihang University

Research output: Contribution to conference › Paper › peer-review

7 Scopus citations

Abstract

A Printed Circuit Board (PCB) diagnosis system based on infrared thermal imaging is described in this paper. Multi-scale edge detection and nonlinear regression methods are used for heat source recognition and thermal feature extraction respectively. Thermal pattern recognition is implemented by support vector classifier instead of traditional Back-Propagation Feed-Forward Network (BPFFN) classifier, which generates poorly on the diagnosis application, and good experimental result has been achieved.

Original language	English
Pages	2718-2722
Number of pages	5
State	Published - 2002
Event	Proceedings of the 4th World Congress on Intelligent Control and Automation - Shanghai, China Duration: 10 Jun 2002 → 14 Jun 2002

Conference

Conference	Proceedings of the 4th World Congress on Intelligent Control and Automation
Country/Territory	China
City	Shanghai
Period	10/06/02 → 14/06/02

Keywords

Diagnosis
PCB
Support vector classifier

Cite this

@conference{8ef7b618e7f34fd79df4f9d7ae04237c,

title = "PCB infrared thermal imaging diagnosis using support vector classifier",

abstract = "A Printed Circuit Board (PCB) diagnosis system based on infrared thermal imaging is described in this paper. Multi-scale edge detection and nonlinear regression methods are used for heat source recognition and thermal feature extraction respectively. Thermal pattern recognition is implemented by support vector classifier instead of traditional Back-Propagation Feed-Forward Network (BPFFN) classifier, which generates poorly on the diagnosis application, and good experimental result has been achieved.",

keywords = "Diagnosis, PCB, Support vector classifier",

author = "Jiuqing Wan and Xingshan Li",

year = "2002",

language = "英语",

pages = "2718--2722",

note = "Proceedings of the 4th World Congress on Intelligent Control and Automation ; Conference date: 10-06-2002 Through 14-06-2002",

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TY - CONF

T1 - PCB infrared thermal imaging diagnosis using support vector classifier

AU - Wan, Jiuqing

AU - Li, Xingshan

PY - 2002

Y1 - 2002

N2 - A Printed Circuit Board (PCB) diagnosis system based on infrared thermal imaging is described in this paper. Multi-scale edge detection and nonlinear regression methods are used for heat source recognition and thermal feature extraction respectively. Thermal pattern recognition is implemented by support vector classifier instead of traditional Back-Propagation Feed-Forward Network (BPFFN) classifier, which generates poorly on the diagnosis application, and good experimental result has been achieved.

AB - A Printed Circuit Board (PCB) diagnosis system based on infrared thermal imaging is described in this paper. Multi-scale edge detection and nonlinear regression methods are used for heat source recognition and thermal feature extraction respectively. Thermal pattern recognition is implemented by support vector classifier instead of traditional Back-Propagation Feed-Forward Network (BPFFN) classifier, which generates poorly on the diagnosis application, and good experimental result has been achieved.

KW - Diagnosis

KW - PCB

KW - Support vector classifier

UR - https://www.scopus.com/pages/publications/0036946397

M3 - 论文

AN - SCOPUS:0036946397

SP - 2718

EP - 2722

T2 - Proceedings of the 4th World Congress on Intelligent Control and Automation

Y2 - 10 June 2002 through 14 June 2002

ER -

PCB infrared thermal imaging diagnosis using support vector classifier

Abstract

Conference

Keywords

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Cite this