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Pattern analysis on diffusion bonding of TC4 and QAL10-3-1.5

  • Wei Guo*
  • , Xi Hua Zhao
  • , Min Xia Song
  • , Ji Cai Feng
  • , Biao Yang
  • *Corresponding author for this work
  • Jilin University
  • Harbin Institute of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Diffusion bonding of TC4 and QAL10-3-1. 5 was carried out under the condition of 850 ° , 8 MPa and 30 min, but there are cracks existing on local area of diffusion zone. Microstructure of diffusion zone was analyzed using scanning electron microscopy ( SEM) , and diffusion distance and concentration distribution of elements were analyzed using EDS. The result shows that the transition zone thickness is 10 μm. Diffusion distance of element increases with increasing bonding time followed a parabolic law; x2 = Kp (t - t0) , and phenomenon of transition zone moving to TC4 are observed which is so called kirkendall effect . The occurrence of the cracks on the diffusion zone was studied in the theory of interfacial pore and the reason for micro-cracks produced and improvement methods are found out. Thus, approving diffusion joint is attained by improving the welding process.

Original languageEnglish
Pages (from-to)285-288
Number of pages4
JournalJilin Daxue Xuebao (Gongxueban)/Journal of Jilin University (Engineering and Technology Edition)
Volume36
Issue number3
StatePublished - May 2006
Externally publishedYes

Keywords

  • Copper alloy
  • Crack
  • Diffusion bonding
  • Materials synthesis and processing technology
  • Microstructure
  • Titanium alloy

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