@inproceedings{7181f6dce8a249b694077044a2c973e1,
title = "Parametric modeling and finite element simulation of gear ring system based on creo and ABAQUS",
abstract = "Internal meshing is a commonly used mode of meshing between gears. In this paper, we focus on the parametric modeling method for spur gears in Creo 2.0 and how it can be used to design corresponding gear and gear ring systems. The Abaqus 2020 software was utilized to perform finite element simulation experiments on the internal gear-ring system under specified working conditions, allowing us to obtain detailed information on the stress and strain distribution within the system.The parametric modeling method used in this study involves the use of advanced mathematical algorithms to create a digital representation of the gear's geometry, including its teeth profile, root diameter, pitch diameter, and other critical parameters. This digital representation is then used to generate a virtual model of the gear and its associated components, such as the gear ring.By using the Abaqus 2020 software, we were able to simulate the internal meshing of the gear and its associated components under a range of different operating conditions, including high loads, high speeds, and high temperatures. These simulations allowed us to evaluate the performance of the internal gear-ring system under real-world conditions and identify any potential weaknesses or areas for improvement.",
keywords = "finite element, formatting, Internal engagement, parametric modeling, simulation analysis",
author = "Jing Guo and Xinrui Tao and Minghui Lin and Hanjun Gao",
note = "Publisher Copyright: {\textcopyright} 2023 SPIE.; 3rd International Conference on Electronics, Electrical and Information Engineering, ICEEIE 2023 ; Conference date: 11-08-2023 Through 13-08-2023",
year = "2023",
doi = "10.1117/12.3008662",
language = "英语",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Xilong Qu",
booktitle = "Third International Conference on Electronics, Electrical and Information Engineering, ICEEIE 2023",
address = "美国",
}