TY - GEN
T1 - Optimization Design and Horizontal Stiffness Analysis of Three-wire Pendulum Mechanism of Air Spring Vibration Isolator
AU - Liu, Chengyao
AU - Li, Wanguo
AU - Zheng, Shicheng
AU - Chen, Jiaming
N1 - Publisher Copyright:
© 2020 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - Vibration will affect the performance of high-precision equipment, so it is necessary for the research of vibration isolators. This paper takes air spring vibration isolators applied to high-precision chip testing equipment as the research object, and designs a three-wire pendulum mechanism with a ball hinge structure. The ball-hinge structure can reduce the horizontal stiffness of the three-wire pendulum mechanism, thereby improving the isolation performance of the vibration isolator. Then the mathematical model of the three-wire pendulum mechanism is established, and the factors that affect the horizontal stiffness of the three-wire pendulum mechanism when subjected to slight vibration are obtained through theoretical analysis. Finally, ANSYS Workbench is used to carry out the finite element simulation analysis, which verifies the results of the theoretical analysis. Reducing the diameter of the fixed plate of the swing rod can reduce the horizontal stiffness of the swing mechanism. When the diameter of the fixed plate of the swing rod is reduced by 2%, the horizontal rigidity is reduced by 5.86%; Increasing the diameter of the wobble plate can reduce the horizontal stiffness of the pendulum mechanism. When the diameter of the wobble plate is increased by 2%, the horizontal stiffness is reduced by 4.96%; Increasing the distance between the fixed plate of the swing rod and the swing plate can reduce the horizontal stiffness of the swing mechanism. When the distance between the fixed plate of the swing rod and the swing plate is increased by 2%, the horizontal rigidity is reduced by 3.99%. It provides a basis for the subsequent research on vibration isolators using the three-wire pendulum mechanism.
AB - Vibration will affect the performance of high-precision equipment, so it is necessary for the research of vibration isolators. This paper takes air spring vibration isolators applied to high-precision chip testing equipment as the research object, and designs a three-wire pendulum mechanism with a ball hinge structure. The ball-hinge structure can reduce the horizontal stiffness of the three-wire pendulum mechanism, thereby improving the isolation performance of the vibration isolator. Then the mathematical model of the three-wire pendulum mechanism is established, and the factors that affect the horizontal stiffness of the three-wire pendulum mechanism when subjected to slight vibration are obtained through theoretical analysis. Finally, ANSYS Workbench is used to carry out the finite element simulation analysis, which verifies the results of the theoretical analysis. Reducing the diameter of the fixed plate of the swing rod can reduce the horizontal stiffness of the swing mechanism. When the diameter of the fixed plate of the swing rod is reduced by 2%, the horizontal rigidity is reduced by 5.86%; Increasing the diameter of the wobble plate can reduce the horizontal stiffness of the pendulum mechanism. When the diameter of the wobble plate is increased by 2%, the horizontal stiffness is reduced by 4.96%; Increasing the distance between the fixed plate of the swing rod and the swing plate can reduce the horizontal stiffness of the swing mechanism. When the distance between the fixed plate of the swing rod and the swing plate is increased by 2%, the horizontal rigidity is reduced by 3.99%. It provides a basis for the subsequent research on vibration isolators using the three-wire pendulum mechanism.
KW - air spring vibration isolator
KW - analysis of horizontal stiffness
KW - finite element analysis
KW - three-wire pendulum with ball hinge structure
UR - https://www.scopus.com/pages/publications/85092738204
U2 - 10.1109/ICPICS50287.2020.9202179
DO - 10.1109/ICPICS50287.2020.9202179
M3 - 会议稿件
AN - SCOPUS:85092738204
T3 - Proceedings of 2020 IEEE International Conference on Power, Intelligent Computing and Systems, ICPICS 2020
SP - 506
EP - 511
BT - Proceedings of 2020 IEEE International Conference on Power, Intelligent Computing and Systems, ICPICS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE International Conference on Power, Intelligent Computing and Systems, ICPICS 2020
Y2 - 28 July 2020 through 30 July 2020
ER -