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NiTi形状记忆合金电弧熔融涂覆及微连接机理

Translated title of the contribution: Arc-fused Coating Process and Micro-joining Mechanism of NiTi Shape Memory Alloys
  • Wenchao Ke
  • , Baoqiang Cong
  • , Zewu Qi
  • , Sansan Ao
  • , Bowen Pang
  • , Wei Guo
  • , Bei Peng
  • , Zhi Zeng*
  • *Corresponding author for this work
  • University of Electronic Science and Technology of China
  • Tianjin University

Research output: Contribution to journalArticlepeer-review

Abstract

NiTi Shape memory alloys (SMAs) is one of the most promising coating materials to improve the wear and oxidation resistance of the base components. In the study, the conventional direct current and ultra high-frequency pulsed (UHFP) current were respectively utilized to deposit 3-layer NiTi-coating on TA1 pure titanium substrates with tungsten inert gas welding (TIG)arc-fused coating technology. Using FLUENT software, a computational fluid dynamics (CFD) simulation model was established to analyze the coating process and micro-joining mechanism. The multiphysics, NiTi droplet transfer, Ni element transport and distribution in the micro interlayers were numerical analyzed under UHFP current compared with the direct current case. The numerical and experimental results agree well. It can be concluded that the 3-layer coatings are mainly composed of B19' NiTi martensites and NiTi2 phases, in which NiTi with nearly equal atomic ratio is dominant. The coating of the direct current case is mainly composed of coarse globular grains, while refined into smaller dendrites once UHFP current is used. In addition, the UHFP current is beneficial to the vibration of the molten pool, which promotes the uniform distribution of Ni element and effectively improves the forming quality of the coatings.

Translated title of the contributionArc-fused Coating Process and Micro-joining Mechanism of NiTi Shape Memory Alloys
Original languageChinese (Traditional)
Pages (from-to)176-184
Number of pages9
JournalJixie Gongcheng Xuebao/Journal of Mechanical Engineering
Volume58
Issue number2
DOIs
StatePublished - 20 Jan 2022

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