Abstract
A high-end application-oriented high productivity computer generally features high-performance, high integration, high heat density and high complexity. As a complex system engineering, its design flow involves several stages, and at each stage there are several targets, such as functionality, performance, reliability, which are mutual restraint but should be taken into account simultaneously. In practice, it is a key issue to arrange the collaborative design on these aspects in an orderly manner. A co-design methodology is presented and is applied to the design of a 16-way high density computer based on domestic Godson 3A central processing unit, and the effectiveness of which is verified through software simulation and real test.
| Original language | English |
|---|---|
| Pages (from-to) | 806-812 |
| Number of pages | 7 |
| Journal | Xi Tong Gong Cheng Yu Dian Zi Ji Shu/Systems Engineering and Electronics |
| Volume | 34 |
| Issue number | 4 |
| DOIs | |
| State | Published - Apr 2012 |
Keywords
- Chip multiprocessor (CMP)
- Co-design
- High power-efficient
- High-density computer
- Multi-objective
- Trade-off
Fingerprint
Dive into the research topics of 'Multi-objective design methodology for CMP-based high-density computers'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver