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Modeling of Electromagnetic Disturbance Characteristics of Bus Network Protocol Chip

  • Xingyu Li
  • , Zhaowen Yan
  • , Yunxiang Jia
  • , Siyi Xing
  • , Changshun Fu
  • , Jianhao Ge

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The study introduces a quantitative model that primarily endeavors to analyze and forecast the conducted emission behaviors of several archetypal digital devices. Through rigorous testing of the conducted emissions from representative digital chips, a model for the conducted emissions of digital integrated circuit chips is constructed, drawing upon the test outcomes. The Power Delivery Network model is acquired employing vector fitting techniques, whereas the chip's internal source model is deduced via indirect measurement methods. The comparative analysis reveals that the quantitative model's error margin remains within 3dB of the actual measured data, demonstrating its high degree of accuracy.

Original languageEnglish
Title of host publication2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798331533922
DOIs
StatePublished - 2024
Event10th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024 - Guangzhou, China
Duration: 27 Nov 202430 Nov 2024

Publication series

Name2024 IEEE 10th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024

Conference

Conference10th IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2024
Country/TerritoryChina
CityGuangzhou
Period27/11/2430/11/24

Keywords

  • ICEM-CE
  • conducted emission
  • digital chip
  • vector fitting

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